Specifications: Thermal conductivity: >4.0 W/mK (Hot Wire Method Per MIL-C-47113) Thermal Resistance: 160°C Long-Term: – 40°C to 125°C Lower full load core temperatures: 2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads. When measured with a calibrated thermal diode imbedded in the CPU core. Features: 1.75 gram tubes. (A bit more than 1cc) This is enough compound to cover at least 25 to 35 small CPU cores, or 9 to 15 large CPU cores, or 4 to 8 heat plates. At a layer 0.003" thick, one tube will cover approximately 24 square inches.